Refer to Datasheet for thermal solution requirements. See details for additional description. Intel Core i Computer Processors 2. You can search our catalog of processors, chipsets, kits, SSDs, server products and more in several ways. A smart choice for home and office, the Intel Core i3 processor also features Intel Hyper-Threading technology, which enables each core of your processor to work on two tasks at the same time, delivering the performance you need for smart multitasking. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

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Intel Core i3-330M 2.13GHz Dual-Core (CP80617004122AG) Processor

Thermal Design Power TDP represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload.

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. Lenovo Thinkpad L ZG. The lowest-priced brand-new, unused, unopened, undamaged item in its original packaging where packaging is applicable. Intel Core iUM compare. Please, switch itel ad blockers.

Super Pi Mod 1. The different PCI Express versions support different data rates. CPU Cache is an area of fast memory located on the processor.


A bus is a subsystem that transfers data between computer components or between computers. C1 is the first idle state, C2 the second, and so on, where more 330mm saving actions are taken for numerically higher C-states. System and Maximum TDP is based on worst case scenarios.

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Intel Core i3 M

PCI Express Revision is the version supported by the processor. What is the difference between Boxed and Tray Processors? Thank you for your feedback. See details for additional description. Refer to Datasheet for formal definitions of product properties and features. Prices are for direct Intel customers, typically represent 1,unit purchase quantities, and are subject to change without notice. Core i3 3rd Gen. Physical Address Extensions PAE is a feature that allows bit processors to access a physical address space larger than 4 gigabytes.

In the following list you can select and also search for devices that should be added to the comparison. Intel Core iM 2. Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer nmindicative of the size of features built on the semiconductor.

PassMark – Intel Core iM @ GHz – Price performance comparison

All information provided is subject to change at any time, without notice. Packaging should be the same as what is found in a retail store, unless the item is handmade or was packaged by the manufacturer in non-retail packaging, such as an unprinted box or plastic bag.


We show the least amount of ads whenever possible. Show More Show Less. The 32nm cpu cores coee the Westmere generation can also process some new instructions to accelerate AES encryptions. AMD Ryzen 7 X 3. Both are on a separate die that is still manufactured in 45nm whereas the CPU die is already manufactured in the new 32nm process.

Please refer to the Launch Date for market availability. Used for end of life products. For benchmarking data see http: Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice.